COPPER OXIDE (REDUCING & METAL TREATMENT AGENT)

• Appearance: Black to dark brown fine powder, insoluble in water, with a dense and uniform particle structure.
• Application: Used as a copper source and reducing agent in electroless copper plating, printed circuit board (PCB) manufacturing, and metal surface treatment processes to deposit uniform copper layers, improve adhesion, and prepare metal surfaces for subsequent plating operations.
• Product Strength:
  Reliable Copper Source

  Uniform Electroless Deposition

  Excellent PCB Compatibility

  Improved Surface Adhesion